I used to build a lot of computers back in my day, and if you’ve ever done the same, you’ve surely dealt with thermal grease. For those that haven’t, it’s a paste that you put onto the processor between the heatsink that helps to keep it cool.
Sony has recently developed something called the EX20000C that could replace it. It’s made from densely packed silicon that is packed with carbon fiber. The sheet, which would be much easier to install (since it’s not a messy goop), is made 0.3-2.0mm thick with a thermal resistance of 0.4-0.2K·cm2/W. Not only does it have a better thermal resistance, but it has a longer product life. Sony is planning to use the new sheet for servers, high-end projectors, etc. Here’s a picture showing a processor running over 37 degrees (f) cooler than one with thermal grease:
I haven’t seen any pictures of the EX20000C yet, but as soon as we find one we’ll update this post.